复合材料修理参数对胶接层剪切应力影响规律的研究
Effect of Repair Parameters on Shear Stress Distribution of Bondline for Composite Repair Structure

复合材料胶接修理结构中,胶层起着传递载荷的作用,其应力状态对于修理效果有重要影响。本文中得到了修理结构中胶层的应力分布的解析解,与有限元数值结果吻合较好,表明该解析解合理有效。基于该解析解分析了胶层中的应力分布随修理参数的变化,结果表明:增加补片长度和厚度可以降低胶层中的剪应力,但是两者都有临界值,超过临界值后剪应力降低的趋势减缓;胶层中的剪应力随着胶层的厚度增加而减小,随着剪切模量的增加而增大。
For repairing the damaged structure with bonded composite patches, the bondline plays a role of transferring load, its stress state significantly affect the repair results. Both the analytical and numerical methods for forecasting the stress distribution in the bondline are developed in this paper. The analytical results was in a good agreement with the FEM result, which verified the validity of the present model. At last, the effect of the repair parameters on the stress distribution of the bondline was discussed. The results and their analysis showed preliminarily that the increase in patch length and patch thickness can slightly enhance the capacity of patch to share the load, the increase in thickness and the decrease in shear modulus of the bondline could decrease the shear stress