镀有石墨烯层微热压模具电热耦合作用数值仿真
Numerical Simulation of Micro Extrusion Mold Coated with Graphene Layers Coupling Electricity with Heat

提出一种提高微热压模具加热冷却速率、缩短微热压成型循环周期的方法。在硅片表面使用化学气相沉积CVD的方法制备石墨烯层，利用石墨烯层高电导率、热导率等特性，研究石墨烯层电热耦合作用对模具温度的影响规律。模拟结果表明，硅模具施加电势增加或石墨烯层厚增加，硅片表面平均温度的升高速率增大；当石墨烯层厚为40 nm、施加电压为150 V时，硅片表面由室温升温加热速率可以达到9.87 K/s，模具温度稳定后，微结构处的温度略高于硅片表面其他位置。
A method for increasing the micro extrusion mold heating cooling rate and shortening the hot pressing molding cycle was put forward. By coating graphene layers on the silicon wafer surface by CVD(Chemical vapor deposition), according to the properties of graphene with high electrical conductivity and thermal conductivity and so on, the influence of the graphene layer electric coupling on the mold's temperature was studied. The simulation results indicated that the higher voltage and thicker graphene layer would cause a relatively higher temperature rising rate. When the graphene layer has a thickness of 40 nm and the applied voltage is 150 V, the temperature of silicon wafer surface increases quickly to a heating rate of 9.87 K/s from room temperature. When the temperature of the silicon mold temperature is stable, the temperature of the microstructure is higher than the bulk silicon wafer surface