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-  2018 

基于微波固化工艺的碳纤维T800/环氧树脂复合材料固化反应动力学
Kinetics modeling of carbon fiber T800/epoxy resin composites based on microwave curing process

DOI: 10.13801/j.cnki.fhclxb.20171207.001

Keywords: 碳纤维,环氧树脂,复合材料,差示扫描量热法,Kamal模型,粒子群算法,微波固化动力学
carbon fibers
,epoxy resin,composites,differential scanning calorimetry,Kamal model,particle swarm optimization,microwave curing kinetics

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Abstract:

针对微波固化工艺下的碳纤维(T800)/环氧树脂复合材料的固化反应行为,运用非等温差示扫描量热(DSC)法,研究了T800/环氧树脂复合材料的固化反应放热过程。基于Kamal动力学模型,采用粒子群全局优化算法,拟合得到了纯微波固化工艺及高压微波固化工艺的T800/环氧树脂复合材料固化反应动力学方程,通过实验验证,该方程能够很好地描述T800/环氧树脂复合材料微波固化反应动力学行为。并系统对比研究了不同固化工艺方法对T800/环氧树脂复合材料固化反应动力学的影响。结果表明:相比传统热固化工艺,微波固化工艺能够有效提高T800/环氧树脂复合材料的固化反应速率并降低其固化反应的活化能,同时固化压力的引入对T800/环氧树脂复合材料的固化反应有一定的促进作用。 In order to investigate the curing behavior of carbon fiber (T800)/epoxy matrix composites under microwave curing process, the exothermal process of curing reaction of T800/epoxy resin matrix composites was studied by nonisothermal differential scanning calorimetry (DSC). Based on Kamal dynamics model, T800/epoxy resin composite reaction kinetics equation of microwave curing technology and high-pressure microwave curing process was obtained by fitting the particle swarm optimization algorithm. And the effect of different curing methods on the curing kinetics of T800/epoxy resin composite was systematically compared. The experimental results show that the equation can well describe the microwave curing behavior of T800/epoxy resin composites. The results show that compared with the traditional thermal curing process, the microwave curing process can effectively improve the curing rate of T800/epoxy resin composite and reduce the activation energy of the curing reaction, while the introduction of curing pressure to the curing reaction of T800/epoxy resin composite have a certain role in promoting. 国家重点基础研究发展计划(2014CB046502)

References

[1]  益小苏, 张明, 安学峰, 等. 先进航空树脂基复合材料研究与应用进展[J]. 工程塑料应用, 2009, 37(10):72-78. YI X S, ZHANG M, AN X F, et al. Development and application of advanced aeronautical polymer matrix composites[J]. Engineering Plastics Application, 2009, 37(10):72-78(in Chinese).
[2]  徐学宏, 王小群, 闫超, 等. 环氧树脂及其复合材料微波固化研究进展[J]. 材料工程, 2016, 44(8):111-120. XU X H, WANG X Q, YAN C, et al. Research progress on microwave curing of epoxy resin and its composites[J]. Journal of Materials Engineering, 2016, 44(8):111-120(in Chinese).
[3]  BOEY F Y C, YAP B H. Microwave curing of an epoxy-amine system:Effect of curing agent on the glass-transition temperature[J]. Polymer Testing, 2001, 20(8):837-845.
[4]  WEI J H, HAWLEY M C, DELONG J D, et al. Comparison of microwave and thermal cure of epoxy resins[J]. Polymer Engineering and Science, 1993, 33(17):1132-1140.
[5]  陈明华, 姚武文, 王新坤, 等. 微波固化碳纤维/环氧树脂胶的研究[J]. 粘接, 2005, 26(6):13-15. CHEN M H, YAO W W, WANG X K, et al. Study on microwave curing of epoxy resin adhesive[J]. Adhesion in China, 2005, 26(6):13-15(in Chinese).
[6]  KAMAL M R, SOUROUR S. Kinetics and thermal characterization of thermoset cure[J]. Polymer Engineering & Science, 1973, 13(1):59-64.
[7]  HAYATY M, BEHESHTY M H, ESFANDEH M. Cure kinetics of scanning calorimetry[J]. Journal of Applied Polymer Science, 2011, 120(1):62-69.
[8]  TRIPATHI G, SRIVASTAVA D. Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data[J]. Journal of Applied Polymer Science, 2009, 112(5):3119-3126.
[9]  曾秀妮, 段跃新. 840S环氧树脂体系固化反应特性[J]. 复合材料学报, 2007, 24(3):100-104. ZENG X N, DUAN Y X. Curing reaction characteristics of 840S epoxy resin[J]. Acta Materiae Compositae Sinica, 2007, 24(3):100-104(in Chinese).
[10]  于佳, 张博明, 王殿富, 等. 典型双马来酰亚胺树脂固化动力学模型的研究[J]. 复合材料学报, 2004, 21(1):78-83. YU J, ZHANG B M, WANG D F, et al. Study of cure kinetic model of typical bismeleimide[J]. Acta Materiae Compositae Sinica, 2004, 21(1):78-83(in Chinese).
[11]  杜善义. 先进复合材料与航空航天[J]. 复合材料学报. 2007, 24(1):1-12. DU S Y. Advanced composite materials and aerospace engineering[J]. Acta Materiae Compositae Sinica, 2007, 24(1):1-12(in Chinese).
[12]  THOSTENSON E T, CHOU T W. Microwave processing fundamentals and applications[J]. Composites Part A:Applied Science and Manufacturing, 1999, 30(9):1055-1071.
[13]  刘学清, 王源升. 微波固化环氧树脂(E44/DDM)的热性能及膨胀性能[J]. 高分子材料科学与工程, 2004, 20(3):111-113. LIU X Q, WANG Y S. Microwave cure of epoxy resin (E44/DDM) and study on properties of thermal and expansion[J]. Polymer Materials Science & Engineering, 2004, 20(3):111-113(in Chinese).
[14]  王遵, 邢素丽, 曾竟成, 等. 热固性树脂固化反应动力学模型研究进展[J]. 高分子材料科学与工程, 2007, 23(4):11-14. WANG Z, XING S L, ZHENG J C, et al. Cure kinetic models of thermosetting resins and the state of the art[J]. Polymer Materials Science and Engineering, 2007, 23(4):11-14(in Chinese).
[15]  张明, 安学峰, 唐邦铭, 等. 高性能双组份环氧树脂固化动力学研究和TTT图绘制[J]. 复合材料学报, 2006, 23(1):17-25. ZHANG M, AN X F, TANG B M, et al. Curing kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites[J]. Acta Materiae Compositae Sinica, 2006, 23(1):17-25(in Chinese).
[16]  杨帆. 复合材料树脂固化过程的数值模拟[D]. 哈尔滨:哈尔滨工业大学, 2006. YANG F. Simulation on the cure process of resin in composites[D]. Harbin:Harbin Institute of Technology, 2006(in Chinese).
[17]  HUANG Y J, LU T J, HWU W. Curing of unsaturated polymer resins:Effects of pressure[J]. Polymer Engineering and Science, 1993, 33(1):1-17.
[18]  初琳, 赵晓莉, 王丽娟. 树脂基复合材料固化技术发展现状[J]. 化工装备技术, 2013, 34(1):43-48. CHU L, ZHAO X L, WANG L J. Current status of curing technology for polymer matrix composites[J]. Chemical Equipment Technology, 2013, 34(1):43-48(in Chinese).

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