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材料工程  2010 

Al含量对Cu基Ni镀层表面渗Si层组织和力学性能的影响

, PP. 52-57

Keywords: Cu基体,Ni镀层,渗Si渗层,Ni-Si金属间化合物,摩擦系数

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Abstract:

采用料浆包渗法,以SiO2粉为Si源,纯Al粉为还原剂,NaF和NH4Cl作为复合活化剂,Al2O3为惰性添加剂,蛋白质(鸡蛋清)为黏结剂,在Cu表面预先镀Ni层随后900℃,12h表面渗Si,制备渗Ni-Si层。研究了Al粉含量对渗Si层组织和力学性能的影响。结果表明随铝粉含量的增加,渗层组织出现以下转变Ni3Si+Ni31Si12→Ni31Si12+Ni2Si→Ni3Si+NiAl,包渗过程由渗硅为主转变为渗铝为主;渗层硬度增加;摩擦系数由铝粉含量为10%(质量分数,下同)时的0.37降低到45%时的0.18,分别为纯铜的1/2,1/5。

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