蒋荣华,肖顺珍.砷化镓材料的发展与前景[J].世界有色金属,2002,8:7–13.JIANG Ronghua,XIAO Shunzhen.World Nonferrous Met(in Chi-nese),2002,8:7–13. [2]刘向阳,郁鼎文,王立江,等.无磨料低温抛光的工艺方法研究[J].机械设计与制造,2005(1):71–73.LIU Xiangyang,YU Dingwen,WANG Lijiang,et al.Mach Des Manuf(in Chinese),2005(1):71–73. [3]韩荣久,孙恒德,徐德全.单晶硅片的低温抛光技术[J].光学精密工程,1998,6(5):104–109.HAN Rongjiu,SUN Hengde,XU Dequan.Opt Precision Eng(in Chi-nese),1998,6(5):104–109. [4]陈明君,王立松,梁迎春,等.脆性材料塑性域的超精密加工方法[J].航空精密制造技术,2001,37(2):10–25.CHEN Mingjun,WANG Lisong,LIANG Yingchun,et al.Aviat Precis Manuf Technol(in Chinese),2001,37(2):10–25. [5]Chiao Y H,Clarke D R.Direct observation of dislocation emission from crack tips in silicon at high temperatures[J].Acta Metall,1989,37(1):203–219. [6]徐德胜.半导体制冷与应用技术[M].上海:上海交通大学出版社,1992:40–42.XU Desheng.The Technology of Semiconductor Refrigeration(in Chinese).Shanghai:Shanghai Jiaotong University Pess,1992:40–42. [7]郑永明,方方,徐建一,等.半导体致冷原理及其应用系统设计研究[J].中国测试技术,2006,32(2):49–51.ZHENG Yongming,FANG Fang,XU Jianyi,et al.China Meas Tech-nol(in Chinese),2006,32(2):49–51. [8]胡赓祥,蔡珣.材料科学基础[M].上海:上海交通大学出版社,2005:16–36.HU Gengxiang,CAI Xun.Materials Science Foundation(in Chinese).Shanghai:Shanghai Jiaotong University Press,2005:16–36. [9]PENG Z J,GONG J H,MIAO H Z.On the description of indentation size effect in hardness testing for ceramics:analysis of the nano-in-dentation data[J].J Eur Ceram Soc,2004,24:2193–2201. [10]孙玉利.冰冻固结磨料化学机械抛光单晶硅片的基础研究[D].南京:南京航空航天大学,2007.SUN Yuli.Basic research on CMP of silicon wafer with ice fixed abra-sives(in Chinese,dissertation).Nangjing:Nanjing University of Aeronautics and Astronautics,2007. [11]李东生,杨德仁,阙端麟.杂质对单晶硅材料硬度的作用[J].半导体学报,2004,25(7):799–802.LI Dongsheng,YANG Deren,QUE Ruilin.Chin J Semiconduct(in Chinese),2004,25(7):799–802. [12]张琼.周海芳,李斗星.室温下单晶硅压痕裂纹的形成与扩展[J].电子显微学报,2002,2(1):56–58.ZHANG Qiong,ZHOU Haifang,LI Douxing.J Chine Electron Mi-croscopy Soc(in Chinese),2002,2(1):56–58. [13]LAWN B R,EVANS A G,MARSHALL D B.Elastic/Plastic indention damage in ceramics:the median/radial crack system[J].J Am Ceram Soc,1980,63:574–581. [14]周亮,姚学英,SHAHJADA A P.纳米压痕硬度尺寸效应的残余面积最大压深模型[J].硅酸盐学报,2005,33(7):817–821.ZHOU Liang,YANG Xueying,SHAHJADA A P.J Chin Ceram Soc(in Chinese),2005,33(7):17–821. [15]BEEGAN D,CHOWDHURY S,LAUGIER M T.Work of indentation methods for determining copper film hardness[J].Surf Coat Technical,2005,192:57–63. [16]龚江宏,赵喆,吴建军,等.陶瓷材料Vickers硬度的压痕尺寸效应[J].硅酸盐学报,1999,27(6):693–700.GONG Jianghong,ZHAO Zhe,WU Jianjun,et al.J Chin Ceram Soc(in Chinese),1999,27(6):693–700. [17]CHOWDHURY S,LAUGIER M T.The use of non-contact AFM with nano-indentation techniques for measuring mechanical properties of carbon nitride thin films[J].Appl Surf Sci,2004,233:219–226.
