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高气孔率及低热导率多孔莫来石陶瓷的制备

DOI: 10.7521/j.issn.0454-5648.2014.06.03

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Abstract:

采用叔丁醇基凝胶注模工艺制备多孔莫来石陶瓷,研究了固含量和烧结工艺对多孔莫来石陶瓷显微结构、气孔率、气孔尺寸及分布、压缩强度和室温热导率的影响。结果表明,固含量相同时,随着烧结温度的升高,多孔莫来石陶瓷的气孔率不断降低,而抗压强度则不断增加;当固含量为15%、烧结温度为1350℃时,多孔莫来石陶瓷的气孔率最高为71.7%,平均气孔孔径为3.49μm,而热导率则低至0.103W/(m?K)。通过改变烧结温度和初始固含量可调整多孔莫来石陶瓷的微观结构和性能。

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