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放电等离子低温烧结h-BN-SiC 复相陶瓷的结构与力学性能

DOI: 10.14062/j.issn.0454-5648.2015.06.09

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Abstract:

以纳米h-BN和SiC粉为原料、B2O3为烧结助剂,利用放电等离子烧结(SPS)制备h-BN-SiC复相陶瓷,研究了烧结压力(20~50MPa)对h-BN-SiC复相陶瓷结构与力学性能的影响。结果表明在不同烧结压力下,h-BN-SiC复相陶瓷中h-BN晶粒的c轴倾向于平行压力方向,增大烧结压力能够提高复相陶瓷的致密化和力学性能,但较大的烧结压力(>40MPa)降低了c轴倾向于平行压力方向的取向度和断裂韧性。在40MPa烧结压力时获得了较佳的综合性能,复相陶瓷的相对密度、抗弯强度和断裂韧性分别达到98%、289.2MPa和3.45MPa·m1/2,比同条件制备的纯h-BN陶瓷的抗弯强度和断裂韧性分别提高了约138.4%和64.3%。复相陶瓷断裂为典型的沿晶断裂模式,微裂纹及裂纹偏转提高了复相陶瓷的断裂韧性。

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