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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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800H合金动态再结晶行为研究
DOI: 10.3724/SP.J.1037.2012.00236, PP. 1175-1185
Keywords: 800H合金,动态再结晶,本构方程,临界应变,应变诱导晶界迁移
Abstract:
在MMS-300热模拟机上对800H合金进行了单道次压缩实验,结合EBSD和TEM等技术,研究了该合金在850-1100℃和0.01-10s-1变形条件下的动态再结晶行为.结果表明,当变形温度低于950℃时,析出了大量Cr23C6和Ti(C,N)析出相,其对动态再结晶行为产生明显的抑制作用.建立了2段温度区间内(850-950℃和950-1100℃)800H合金的热变形本构方程;采用lnθ-ε曲线的三次多项式拟合求解拐点的方法,较准确地预测了800H合金动态再结晶临界应力/峰值应力和临界应变/峰值应变的比值,并建立了临界应力、临界应变与$Z$参数的关系;800H合金在热变形过程中动态再结晶形核机制主要包括应变诱导晶界迁移、晶粒碎化以及亚晶合并形核机制.
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