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OALib Journal期刊
ISSN: 2333-9721
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Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应
DOI: DOI:10.3724/SP.J.1037.2009.00688, PP. 366-371
Keywords: 无铅焊点,剪切断裂,体积效应,金属间化合物
Abstract:
采用直径范围为200-600μm的Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘上制作热风重熔焊点,将重熔焊点在150℃下进行老化,并对重熔和老化焊点进行剪切测试.结果表明重熔和老化后焊点的剪切强度都随体积的增大而减小,表现出显著的体积效应.SEM断面观察显示较小体积焊点剪切断裂发生在钎料块体内部,表现出较好韧性;较大体积焊点则发生在近焊盘的界面处,呈现脆性断裂特征.焊盘界面处和钎料内部微观组织SEM观察表明小体积焊点内部Ag3Sn化合物以小颗粒状弥散分布,起到强化作用;而大体积焊点内部Ag3Sn化合物为树枝网状分布,表现出硬脆性.金属间化合物(如Ag3Sn和Cu6Sn5)的形貌和分布对焊点的断裂行为有显著的影响,是焊点剪切断裂行为体积效应的内在原因.
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