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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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TiCu/Zn界面反应周期层片结构形成的热力学和动力学研究*
DOI: 10.11900/0412.1961.2013.00771, PP. 930-936
Keywords: TiCu/Zn,扩散偶,周期层片结构,热力学,动力学
Abstract:
研究了TiCu/Zn扩散偶在390和450℃退火后的扩散层组织,发现其扩散区域中形成了3类周期层片对,且γ+TiZn3层片对的厚度随温度升高而减小,但与退火时间无关.在TiCu/Zn扩散体系中,反应扩散主要受Zn原子向TiCu基体端扩散控制,Zn原子扩散至TiCu基体界面附近优先形成TiZn3,而Ti原子穿过γ层和Cu原子穿过TiZn3层向富Zn端长程扩散均很困难,Cu原子仅能通过短程扩散聚集形成γ相并长大.周而复始,扩散通道在γ+TiZn3两相区中来回振荡形成周期层片对,且其间距与形成的先后顺序无关.温度的升高加快了原子扩散和TiZn3层的形成,使层片对变薄.扩散通道往富Zn方向穿过三相区后,在经过ε+TiZn3和ε+Ti3Zn22两相区时,同样由于Ti和Cu原子长程扩散困难,形成ε+TiZn3和ε+Ti3Zn22周期层片对.
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