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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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镍钨硼合金电沉积机理及镀层微晶尺寸
, PP. 169-174
Keywords: Ni-W-B合金,电沉积,成核机理,晶粒尺寸
Abstract:
应用循环伏安、恒电位阶跃和X射线衍射(XRD)等方法研究了Ni_W_B合金电沉积特点和镀层微晶尺寸.结果表明,在以柠檬酸铵为络合剂的溶液中,Ni_W_B合金沉积层较Ni_W合金有较低的电化学活性.电位阶跃i～t曲线分析表明,在玻碳电极上Ni_W_B合金电结晶过程遵循扩散控制瞬时成核三维成长模式,且随过电位的增加,电极表面晶核数增多.XRD测试结果表明,随沉积电流密度提高,合金镀层微晶尺寸逐渐增大,说明电流密度提高将更加有利于Ni_W_B合金电结晶过程中的晶核生长.
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