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兵工学报  2013 

高粘弹性流体磨料光整加工的材料去除率模型

DOI: 10.3969/j.issn.1000-1093.2013.12.010, PP. 1555-1561

Keywords: 机械制造工艺与设备,高粘弹性流体磨料,材料去除率模型,切削深度系数,磨料流加工

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Abstract:

?基于磨料流加工介质的高粘弹性,在分析磨粒所受法向力和参与切削的磨粒数的基础上,建立了高粘弹性流体磨料光整加工的材料去除率模型。定义了材料去除率模型的切削深度系数,提出了一种用圆管工件测定切削深度系数的方法;并用圆管试件测定了Ⅰ号流体磨料加工45#钢、T8钢和Q235-A材料时的切削深度系数。结果表明:材料去除率与流体磨料对工件的壁面压力、壁滑速度和切削深度系数成正比关系;决定切削深度系数的因素主要有磨粒的粒度、磨粒与载体的混合比和流体磨料的弹性及工件的硬度和表面粗糙度;在流体磨料粘性较高、加工流量较大条件下,可用流体磨料的过流长度和压力来测定切削深度系数。

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