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热等静压处理对U/Al镀层界面特性的影响

, PP. 456-459

Keywords: 热等静压,U/Al镀层,界面特性

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Abstract:

采用扫描电镜(SEM)、能谱仪(EDS)、X射线结构衍射仪(XRD)及拉伸实验等方法,研究了铀(U)上磁控溅射Al镀层在480℃,2小时,60MPa条件下热等静压(HIP)处理对界面特性以及膜基结合强度的影响.结果表明经HIP处理后,镀层密度达到了其理论密度;镀层由柱状晶转变为致密的层状结构,在界面处Al、U元素形成了互扩散,并生成了金属间化合物UAl2和UAl3;膜基结合形成了冶金结合,结合强度有所增强.

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