POWER AWARE PHYSICAL MODEL FOR 3D IC’S

In this work we have proposed a geometric model that is employed to devise a scheme for identifying thehotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance andreliability of the chip. The model namely continuous unit sphere model has been presented taking intoaccount that the 3D region of the chip is uniform, thereby reflecting on the possible locations of heatsources and the target observation points. The experimental results for the – continuous domain establishthat a region which does not contain any heat sources may become hotter than the regions containing thethermal sources. Thus a hotspot may appear away from the active sources, and placing heat sinks on theactive thermal sources alone may not suffice to tackle thermal imbalance. Power management techniquesaid in obtaining a uniform power profile throughout the chip, but we propose an algorithm using minimumbipartite matching where we try to move the sources minimally (with minimum perturbation in the chipfloor plan) near cooler points (blocks) to obtain a uniform power profile due to diffusion of heat fromhotter point to cooler ones.