This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.
References
[1]
Petersen, KE. Silicon Sensor Technologies. Proceedings of the International Electron Devices Meeting, Washington, DC, USA, 1–4 December 1985; pp. 2–7.
[2]
Barlian, AA; Park, WT; Mallon, JR; Rastegar, AJ; Pruitt, BL. Review: Semiconductor piezoresistance for microsystems. Proc. IEEE 2009, 97, 513–552.
[3]
French, PJ. Polysilicon: A versatile material for microsystems. Sens. Actuat. A 2002, 99, 3–12.
Engesser, M; Franke, AR; Maute, M; Meisel, DC; Korvink, JG. Miniaturization limits of piezoresistive MEMS accelerometers. Microsyst. Technol 2009, 15, 1835–1844.
[6]
Li, Y; Zheng, Q; Hu, Y; Xu, Y. Micromachined piezoresistive accelerometers based on an asymmetrically gapped cantilever. J. Microelectromech. Syst 2011, 20, 83–94.
[7]
Li, X; Cheng, B; Wang, Y; Gu, L; Dong, J; Yang, H; Song, Z. A Trench-Sidewall single-Wafer-MEMS Technology and Its Typical Application in High-Performance Accelerometers. Proeedings of the Technical Digest of the IEEE International Electron Devices Meeting, San Francisco, CA, USA, 13–15 December 2004; pp. 43–46.
[8]
Baltes, H; Brand, O; Hierlemann, A; Lange, D; Hagleitner, C. CMOS MEMS-Present and Future. Proceedings of the 5th IEEE International Conference on MEMS, Las Vegas, NV, USA, January 2002; pp. 459–466.
[9]
Fedder, GK; Howe, RT; Liu, TJK; Quevy, EP. Technologies for cofabricating MEMS and electronics. Proc. IEEE 2008, 96, 306–322.
[10]
Chaehoi, A; Latorre, L; Nouet, P; Baglio, S. Piezoresistive CMOS beams for inertial sensing. Proc. IEEE Sens 2003, 1, 451–456.
[11]
Kruglick, EJ; Warneke, BA; Pister, KS. CMOS 3-Axis Accelerometers with Integrated Amplifier. Proceedings of the 11th International Workshop on MEMS, Heidelberg, Germany, 25–29 January 1998; pp. 631–636.
Qu, H; Xie, H. Process development for CMOS-MEMS sensors with robust electrically isolated bulk silicon microstructures. J. Microelectromech. Syst 2007, 16, 1152–1161.
Plaza, JA; Collado, A; Cabruja, E; Esteve, J. Piezoresistive accelerometers for MCM package. J. Microelectromech. Syst 2002, 11, 794–801.
[16]
MOSIS. MOSIS Wafer Acceptance Tests, Available online: http://www.mosis.com/cgi-bin/cgiwrap/umosis/swp/params/ami-c5/t91t-params.txt (accessed on 3 August 2011).