Fabrication cost analysis of three-dimensional integrated circuits
三维芯片制造成本分析

Merits of three-dimensional 3D integration offers a technology that meets the requirements of the current trend in many-core processors. However, cost is always the dominant factor of adoption of this new technology. After it implemented introduction of a fabrication cost model which evaluated 2D, homogeneous 3D and heterogeneous 3D architectures in some designs. The fabrication costs of these designs and drawn a conclusion that when the number of gates was large, 3D implementations were more and more cost-efficient than the 2D baseline with the increase of gates.