Pyrosol process for deposition of fluorine-doped tin dioxide thin films
溶胶凝胶法制备参氟二氧化锡薄膜

Transparent low-resistance SnO$_{2}$:F films, suitable as a low-emissivity and conducting coating, have been deposited on silica-coated soda lime glass substrates by pyrosol process. SnCl$_{4}\cdot $5H$_{2}$O and NH$_{4}$F dissolved in solvent of 50{\%} C$_{2}$H$_{5}$OH/50{\%} H$_{2}$O served as the starting solution. With the parameters such as substrate temperature of 450${^\circ}$C, distance between the nozzle and substrate of 60mm, carrier gas flow rate of 8L/min and deposition time of 5min, the optimized SnO$_{2}$:F films having a sheet resistance of about 2$\Omega$/$\Box$, were deposited repeatedly. The relationship between sheet resistances and infrared transmission spectra of SnO$_{2}$:F films is shown schematically.