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半导体学报 2008
Texture Analysis of Damascene Copper Interconnects
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Abstract:
Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD.All specimens appear mixed texture and(111)texture is the dominate component.As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found.Lower aspect ratio of lines and anneal treatment procured larger grains and stronger(111)texture.Meanwhile,the intensity proportion of other textures with...