Study of Silicon Wafer Cleaning Effects Using Clean Solutions Containing Surfactants and Chelates
用含表面活性剂和螯合剂的清洗液清洗硅片的研究

A new semiconductor cleaning technique is reported using the clean detergent containing surfactants and chelates.The cleaning effects with two techniques are compared with each other including the silicon surface chemical composition that is observed with X-ray photoelectron spectra,and the morphology observed with the atomic force microscope.The measurement results show that the new technique as effective as the RCA standard clean technique,while considering the impact of the surface roughness on silicon wafer cleaning,the new technique is more effective than the RCA standard system.Moreover,the two techniques are of the carbon contamination in equal quantity.