%0 Journal Article %T 基于MWORKS平台智能垃圾桶仿真设计
Design and Simulation of Intelligent Trash Bin System Based on MWORKS %A 章顺荣 %A 钟镇阳 %A 邹杰 %A 慕心桥 %A 原浩杰 %A 徐昊忻 %A 杨焜 %A 涂远达 %A 甄小琼 %J Software Engineering and Applications %P 359-372 %@ 2325-2278 %D 2026 %I Hans Publishing %R 10.12677/sea.2026.152034 %X 本研究设计并实现了一款基于MWORKS建模仿真平台的智能垃圾桶系统,针对传统垃圾桶功能单一、智能化程度低的问题,集成环境检测、自动开合、满溢报警与垃圾压缩四大核心功能。通过MWORKS完成系统多物理域建模、联合仿真及性能优化,结合STM32F103C8T6主控芯片与各类传感器/执行器搭建硬件架构,在Proteus与Keil平台完成底层代码开发与硬件仿真验证。通过量化对比验证:系统可实现温湿度/空气质量实时检测与显示、0.28 s内红外感应自动开盖、4 cm阈值满溢声光报警及垃圾智能压缩。MWORKS仿真使系统开发周期较传统硬件迭代模式缩短30%,极端场景下功能稳定性较优化前提升25%。该系统兼具实用性与环保性,为智能家居与公共环卫领域的智能垃圾处理提供了高效解决方案。
The limitations of traditional trash bins regarding singular functionality and low intelligence, it integrates four core functions: environmental detection, automatic lid opening/closing, overflow alarming, and trash compression. System-level multi-physical domain modeling, joint simulation, and performance optimization were conducted via MWORKS, while a hardware architecture was established using the STM32F103C8T6 microcontroller alongside various sensors and actuators, with underlying code development and hardware simulation verification completed on Proteus and Keil platforms. Quantitative comparative verification demonstrates that the system achieves real-time monitoring and display of temperature, humidity, and air quality; automatic infrared-sensing lid opening within 0.28 seconds; acoustic-optic alarming triggered by a 4 cm overflow threshold; and intelligent trash compression. Simulation results indicate that MWORKS shortens the system development cycle by 30% compared to traditional hardware iteration modes, while functional stability under extreme scenarios improves by 25% compared to the pre-optimization state. Combining practicality with environmental sustainability, this system provides an efficient solution for intelligent trash disposal in smart home and public sanitation fields. %K MWORKS, %K 智能垃圾桶, %K 建模仿真, %K STM32, %K 传感器融合
MWORKS %K Intelligent Trash Bin %K Modeling and Simulation %K STM32 %K Sensor Fusion %U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=140853