%0 Journal Article %T 双交联壳聚糖基水凝胶的构建及其对Cu2+/Cd2+的高效吸附与再生机制研究
Preparation of Double-Crosslinked Chitosan-Based Hydrogel and Study on Its Efficient Adsorption of Cu2+/Cd2+ and Regeneration Mechanism %A 黄文俊 %A 杨玉华 %A 李可妮 %J Material Sciences %P 864-878 %@ 2160-7621 %D 2025 %I Hans Publishing %R 10.12677/ms.2025.154091 %X 本研究通过自由基聚合与冻融循环协同策略,成功制备了一种双交联壳聚糖基水凝胶吸附剂(CISP)。该材料以衣康酸和甲基丙烯磺酸钠为接枝单体,通过化学交联剂(N,N’-亚甲基双丙烯酰胺)和物理交联骨架(聚乙烯醇)构建三维网络结构。系统研究了CISP对Cu2+与Cd2+的吸附行为及机理,并通过FTIR、XPS、SEM-EDS等表征手段揭示了其功能基团(-COO, -S O 3 , -OH)与金属离子的配位作用。实验表明:在pH 3~5、25℃、投加量3 g/L条件下,CISP对Cu2+与Cd2+的去除率分别达92.9%和91.2%;吸附过程符合伪二级动力学模型和Langmuir等温模型。此外,CISP在7次吸附–解吸循环后仍保持85%以上的去除率,并展现出对Ca2+/Mg2+干扰离子的耐受性。本研究为开发高效、可再生的重金属吸附材料提供了新思路。
A dual-crosslinked chitosan-based hydrogel adsorbent (CISP) was synthesized via a synergistic strategy combining free radical polymerization and freeze-thaw cycling. The three-dimensional network structure was constructed through chemical crosslinking with N,N’-methylenebisacrylamide and physical entanglement with polyvinyl alcohol, while functional groups (-COO, -S O 3 , -OH) were introduced via grafting of itaconic acid and sodium methacrylate sulfonate. The adsorption behaviors and mechanisms of CISP toward Cu2+ and Cd2+ were systematically investigated. FTIR and XPS analyses confirmed the coordination interactions between functional groups and metal ions. Under optimized conditions (pH 3~5, 25˚C, dosage 3 g/L), CISP exhibited removal efficiencies of 92.9% for Cu2+ and 91.2% for Cd2+. The adsorption process followed pseudo-second-order kinetics and Langmuir isotherm models. Remarkably, CISP maintained over 85% removal efficiency after 7 adsorption-desorption cycles and demonstrated tolerance to competitive ions (Ca2+/Mg2+). This work highlights the potential of CISP as a sustainable and regenerable adsorbent for heavy metal remediation. %K 壳聚糖, %K 双交联水凝胶, %K 重金属吸附, %K 化学配位, %K 再生性能
Chitosan %K Double Crosslinked Hydrogel %K Heavy Metal Adsorption %K Chemical Coordination %K Regeneration Performance %U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=113387