%0 Journal Article
%T 装备制造行业中多维RFID的研究进展<br>Research Progress of Multi-Dimensional RFID in Equipment Manufacturing Industry
%A 孙兰萍
%A 葛路伟
%J Modern Physics
%P 145-153
%@ 2161-0924
%D 2024
%I Hans Publishing
%R 10.12677/mp.2024.144017
%X 随着全球经济一体化进程和网络信息时代的加速发展，装备制造行业对RFID芯片的需求不断增加，实现装备制造行业的信息化、可视化、多维化是必然趋势。传统的RFID芯片由于存在资源较少、计算能力较低、存储空间较小等问题而制约其在装备制造行业的广泛应用。为解决上述问题，近些年国内外学者提出了一系列高性能多维RFID芯片。文章综述了国内外多维RFID芯片的基本构成和工作原理，并以此为基础分别从无源工作模式、灯光交互模式、芯片抗金属标签以及芯片封装基材和封装工艺等多个方面对多维RFID芯片的研究进展进行了系统的总结，分析了目前国内外多维RFID芯片的关键设计思路、技术难点、优势以及应用场景，展望了未来多维RFID芯片设计的研究方向。<br />
With the process of global economic integration and the accelerated development of the network information age, the demand for RFID chips in the equipment manufacturing industry is increasing. It is an inevitable trend to realize the informatization, visualization and multi-dimensional of the equipment manufacturing industry. The traditional RFID chip is restricted in its wide application in the equipment manufacturing industry due to the problems of fewer resources, lower computing power and less storage space. In order to solve the above problems, a series of high-performance multi-dimensional RFID chips have been proposed by domestic and foreign scholars in recent years. This paper summarizes the basic structure and working principle of multi-dimensional RFID chips at home and abroad. Based on this, the research progress of multi-dimensional RFID chips is systematically summarized from the aspects of passive working mode, light interaction mode, chip anti-metal tag, chip packaging substrate and packaging technology. The key design ideas, technical difficulties, advantages and application scenarios of multi-dimensional RFID chips at home and abroad are analyzed. Meanwhile, the research direction of multi-dimensional RFID chip design in the future is prospected.
%K 多维RFID，芯片，无源，交互，封装<br>Multi-Dimensional RFID
%K Chip
%K Passive
%K Interactive
%K Encapsulation
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=91663