%0 Journal Article
%T 晶粒取向Mn<sub>2</sub>Sb合金的制备与负热膨胀性能研究<br> Preparation and Study on Negative Thermal Expansion of Mn<sub>2</sub>Sb Alloy with Grain Orientation
%A 宋雨
%A 王凌宇
%A 刘宇峰
%A 缪雪飞
%A 徐锋
%J Material Sciences
%P 1004-1010
%@ 2160-7621
%D 2022
%I Hans Publishing
%R 10.12677/MS.2022.1210112
%X 负热膨胀材料凭借着能够补偿和控制材料热膨胀性能的优点，在高精度仪器和器件的制造中发挥着至关重要的作用。具有一级磁弹性相变的Mn<sub>2</sub>Sb基合金，在从高温铁磁到低温反铁磁的相变过程，会伴随着晶格参数的突变，表现出大的负热膨胀效应，具有巨大的应用潜力。本研究通过定向凝固技术，在具有四方晶体结构的Mn<sub>1.9</sub>Cr<sub>0.1</sub>Sb合金中制备出了{110}取向的样品，借助扫描电子显微镜、X射线衍射仪、综合物性测量系统以及热机械分析仪等系统地表征了其显微结构、磁性能以及负热膨胀等性能。此外，本研究通过定向凝固制备的取向Mn<sub>1.9</sub>Cr<sub>0.1</sub>Sb样品不但致密度高，而且还获得了线膨胀系数为α = ？53.8 ppm/K的大的负热膨胀效应。同时，本研究也为其他负热膨胀材料的制备提供了新策略。<br />
With the advantages of compensating and controlling the thermal expansion of materials, negative thermal expansion materials play an important role in the manufacture of high-precision instruments and devices. Mn<sub>2</sub>Sb-based alloy shows a first-order magnetic transition from high-temperature ferromagnetic state to low-temperature antiferromagnetic state. The magnetic transition is accompanied by a sudden change in the lattice parameters, leading to a large negative thermal expansion effect. In this study, {110}-oriented Mn<sub>1.9</sub>Cr<sub>0.1</sub>Sb alloys were prepared by a directional solidification technique. Its microstructure, grain orientation, magnetic properties, negative thermal expansion and other properties were systematically characterized by means of scanning electron microscope, X-ray diffractometer, comprehensive physical property measure-ment system and thermal mechanical analyzer. The textured Mn<sub>1.9</sub>Cr<sub>0.1</sub>Sb samples show not only a high density, but also a linear expansion coefficient of α = ？53.8 ppm/K. Additionally, our study also provides a new strategy for the preparation of other negative thermal expansion materials.
%K Mn<sub>2</sub>Sb合金，磁弹性相变，定向凝固，负热膨胀<br>Mn<sub>2</sub>Sb-Based Alloy
%K Magnetoelastic Trans-formation
%K Directional Solidification
%K Negative Thermal Expansion
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=57192