%0 Journal Article
%T 激光辐照单晶硅材料的发展现状与展望<br>Development Status and Prospect of Laser Irradiated Monocrystalline Silicon Materials
%A 曾家铭
%A 李昌立
%J Applied Physics
%P 299-303
%@ 2160-7575
%D 2022
%I Hans Publishing
%R 10.12677/APP.2022.125034
%X 单晶硅是常用的红外窗口材料和红外滤波片的基底材料，也是半导体器件和光伏器件的基础材料，被广泛应用于红外滤波片、芯片、太阳能电池板等。单晶硅的加工方式有传统机械加工和激光加工。由于单晶硅属于脆性材料，传统的机械加工效率不高且容易出现切面不平滑或者产生炸裂等问题，影响加工质量。而激光加工相比于金刚石刀具加工具有定位精度高、效率高等优点，目前激光加工技术已经被广泛应用于单晶硅加工领域。而激光与物质相互作用这门科学是激光加工技术的基础，不同脉宽的激光器适用于不同种类的加工。本文以激光脉宽分类，分别介绍其辐照单晶硅材料的发展现状，总结其各自特点，提出单晶硅激光加工工艺需要解决的技术问题。<br />
Monocrystalline silicon is a common infrared window material and the base material of infrared filter. It is also the basic material of semiconductor devices and photovoltaic devices. It is widely used in infrared filter, chip, solar panel and so on. The processing methods of monocrystalline silicon include traditional mechanical processing and laser processing. Because monocrystalline silicon is a brittle material, the traditional machining efficiency is not high, and it is easy to have problems such as uneven section or burst, which affects the machining quality. Compared with diamond tool processing, laser processing has the advantages of high positioning accuracy and high efficiency. At present, laser processing technology has been widely used in the field of monocrystalline silicon processing. The science of the interaction between laser and matter is the basis of laser processing technology. Lasers with different pulse widths are suitable for different kinds of processing. Based on the classification of laser pulse width, this paper introduces the development status of irradiated monocrystalline silicon materials, summarizes their respective characteristics, and puts forward the technical problems to be solved in monocrystalline silicon laser processing technology.
%K 单晶硅，激光加工，发展趋势<br>Monocrystalline Silicon
%K Laser Processing
%K Development Trend
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=51870