%0 Journal Article
%T 石英纤维/含硅芳炔复合材料的制备与性能<br>Preparation and Performance of Quartz Fiber/Silicon-Containing Arylacetylene Composites
%A 肖沅谕
%A 武元娥
%A 沙晓涵
%A 李松
%A 张雪梅
%A 柴笑笑
%J Material Sciences
%P 271-280
%@ 2160-7621
%D 2021
%I Hans Publishing
%R 10.12677/MS.2021.113033
%X 采用DSC、FTIR、TG和流变仪对含硅芳炔树脂(PSA)的固化反应特性、热稳定性以及流变性能进行了表征和分析。以石英纤维(QF)为增强体，采用模压成型工艺制备了QF/PSA复合材料。研究了树脂含量、成型压力、固化温度等不同工艺参数对QF/PSA复合材料力学性能的影响，在此基础上确定了复合材料的成型工艺参数：树脂含量30%，成型压力3.0~4.0 MPa，固化温度为250℃。考察了QF/PSA复合材料300℃和500℃高温下的力学强度以及复合材料在RT-500℃和7~18GHz范围内的介电性能。结果表明，PSA树脂5%热失重温度(Td5)为600℃，10%热失重温度(Td10)为715℃，800℃残炭率为86.3%。所得QF/PSA复合材料具有良好的高温力学性能：300℃下力学强度保持率高于69%，500℃下力学强度保持率高于51%。QF/PSA复合材料在RT~500℃和7~18 GHz的宽频范围内具有稳定的介电常数和介电损耗。<br />
The curing reaction characteristics, thermal stability and rheological Properties of Silicon-con- taining Arylacetylene resin (PSA) were characterized and analyzed by DSC, FTIR, TG and rheome-ter. The QF/PSA composites were prepared by compression molding process with Quartz Fiber (QF) as reinforcement. The effects of different process parameters (resin content, molding pres-sure, curing temperature) on mechanical properties of QF/PSA composites were studied as follows: the resin content 30%, the molding pressure 3.0~4.0 MPa, curing temperature 250？C. On this basis, the molding process system of composites was determined. The mechanical strength of QF/PSA composites at 300℃and 500℃and the dielectric properties of the composites in the range of RT-500℃and 7~18GHz were investigated. According to the results, the decomposition temperature of 5% loss (Td5) and the decomposition temperature of 10% loss (Td10) of the cured PSA are 600？C and 715？C, and its residue rate is up to 86.3% at 800？C. The prepared QF/PSA composites exhibit excellent high temperature mechanical properties: the retention rate of mechanical strength at 300？C is above 69% and the retention rate of mechanical strength at 500？C is above 51%. QF/PSA composites show stable dielectric constant and dielectric loss in the temperature range from room temperature to 500？C and the broad frequency from7GHz to 18 GHz.
%K 含硅芳炔，模压成型，介电性能，力学性能，耐热性能<br>Silicon-Containing Arylacetylene
%K Compression Molding Process
%K Dielectric Properties
%K Mechanical Properties
%K Heat-Resistance Properties
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=41307