%0 Journal Article
%T Improvement of graphene oxide/epoxy resin adhesive properties through interface modification
%A Guangkai Hu
%A Ling Weng
%A Lizhu Liu
%A Xiaorui Zhang
%J High Performance Polymers
%@ 1361-6412
%D 2019
%R 10.1177/0954008318772328
%X The heat-conducting, dielectric, and bonding properties of a composite adhesive have been enhanced using toluene diisocyanate (TDI) to chemically modify the interface between graphene oxide (GO) and epoxy resin (EP), which was characterized using Fourier-transform infrared spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. The thermal conductivity of TDI10-GO0.5/EP was 0.624 W¡¤m£¿1¡¤K£¿1 (166% of EP and 117% of GO0.5/EP), with its TDI10-GO0.5/EP interfacial thermal resistance being reduced by a factor of 36 times GO0.5/EP. The insulating properties of the adhesive in small resistors and capacitors were improved by the inclusion of GO, with the dielectric strength of the adhesive shown to be 25.96 kV¡¤mm£¿1 and its volume resistivity found to be 1.50 ¡Á 1014 ¦¸¡¤m
%K Epoxy adhesive
%K thermal conductivity
%K interfacial thermal resistance
%K influence performances
%K T-peel strength
%U https://journals.sagepub.com/doi/full/10.1177/0954008318772328