%0 Journal Article
%T Improvement on Semiconductor Substrate Design
with Package Modeling and Simulation for Mitigation
of Delamination and Voids
%A Frederick Ray I. Gomez
%A Rammil A. Seguido
%J Journal of Engineering Research and Reports
%D 2018
%X (1) Hachimenum Amadi, Federal University of Technology, Nigeria.
%U http://www.sciencedomain.org/abstract/27173