%0 Journal Article
%T 电解铜箔变形的影响因素分析<br>Analysis of Influencing Factors of Electrolytic Copper Foil Warpage
%A 费翔昱
%A 宫本奎
%A 孙玉梅
%A 冯锐
%A 王学江
%A 韩新俊
%J Material Sciences
%P 162-172
%@ 2160-7621
%D 2020
%I Hans Publishing
%R 10.12677/MS.2020.103021
%X 铜箔作为覆铜板和锂离子电池集流体材料大量使用。为满足轻量化、高容量和高能量密度等要求，需减少铜箔厚度，但在实际生产中，铜箔越薄越易产生翘曲变形，不利于定位、裁切和涂覆。铜箔变形的影响因素主要为添加剂和电解工艺参数，本文综合分析了各因素对铜箔的作用效果，提出了电解铜箔低翘曲生产的主要思路。<br />
The copper foil is widely used in many fields, such as copper clad laminates and current collectors of lithium ion batteries. In order to meet the requirements of lighter weight, higher capacity and higher energy density, the thickness of the copper foil will be reduced. However, in the actual production, the thinner the copper foil is, the more likely it is to warp, also not conducive to positioning, cutting and coating. The influence factors of the deformation for copper foil are mainly the additives and electrolytic process parameters. The effects of influence factors on the copper foil were analyzed, and the main ideas for the production of electrolytic copper foil with low warping were proposed.
%K 铜箔，翘曲变形，影响因素，电沉积<br>Copper Foil
%K Warpage
%K Influence Factors
%K Electrodeposition
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=34846