%0 Journal Article
%T 氢氦离子辐照条件下铍材料的溅射行为<br>Sputtering Behavior of Beryllium Materials Irradiated by Hydrogen-Helium Ions
%A 李东昊
%A 姜进宇
%A 王继冰
%A 简永星
%J Nuclear Science and Technology
%P 73-77
%@ 2332-712X
%D 2019
%I Hans Publishing
%R 10.12677/NST.2019.73010
%X <div style=\"text-align:justify;\">
	<span style=\"line-height:1.5;\">本文借助蒙特卡罗程序SRIM研究了氢氦离子的入射能量和离子数量对铍材料表面溅射行为的影响。分析结果表明，同一种类入射离子在铍中的射程随入射离子的能量增加而增加，铍材料表面的溅射率随入射能量的增加而减小。在相同入射能量下，氢离子在铍中的射程比氦离子更长，而氢离子辐照造成的铍表面溅射率比氦离子更小。在本文的模拟范围内，入射离子的数目对氢氦离子在铍中的射程没有造成显著影响。<br />
Effects of incident energy and amount of hydrogen/helium ions on sputtering behavior of beryl-lium material were investigated by using the Monte Carlo code SRIM in this paper. The results show that the range of incident ion in beryllium increases with the energy of the incident ion, while the sputtering rate on the beryllium surface decreases with the increase of incident energy. Hydrogen ion has a longer range in beryllium than helium ion under the same incident energy, but the sputtering rate of beryllium surface caused by hydrogen ion irradiation is smaller than that by helium ion. Within the simulation scope of this paper, the number of the incident ions has no significant effect on the range of hydrogen and helium ions in beryllium.</span><span style=\"line-height:1.5;\"></span> 
</div>
%K 氢离子，氦离子，溅射，铍材料<br>Hydrogen Ion
%K Helium Ion
%K The Sputtering
%K Beryllium Materials
%U http://www.hanspub.org/journal/PaperInformation.aspx?PaperID=31175