%0 Journal Article %T 低银Sn1.0Ag0.5Cu焊点疲劳寿命预测<br>Fatigue life prediction of low-silver Sn1.0Ag0.5Cu solder joints %A 张亮 %A 孙磊 %A 郭永环 %A 姜海波 %A 钟素娟 %A 马佳 %A 鲍丽 %J 东南大学学报（自然科学版） %D 2015 %R 10.3969/j.issn.1001-0505.2015.04.010 %X 基于Garofalo-Arrhenius蠕变模型, 采用有限元法模拟WLCSP 5×6器件低银Sn1.0Ag0.5Cu无铅焊点的应力-应变响应,并借助蠕变应变疲劳寿命预测模型计算Sn1.0Ag0.5Cu焊点疲劳寿命.结果表明:在交变的温度循环载荷作用下,整个电子器件出现明显的翘曲现象,中心焊点的应力-应变最小,从中心到拐角焊点应力-应变逐渐增加,拐角焊点应力-应变最大.随着服役时间的增加,焊点内部的蠕变应变显著增加.计算Sn3.0Ag0.5Cu,Sn1.0Ag0.5Cu和Sn37Pb三种焊点的疲劳寿命,发现Sn3.0Ag0.5Cu焊点疲劳寿命明显高于另外2种焊点,Sn1.0Ag0.5Cu和Sn37Pb焊点的疲劳寿命相当.证明了低银Sn1.0Ag0.5Cu无铅钎料可以代替Sn37Pb钎料应用于电子封装,研究结果为低银无铅钎料和焊点可靠性的研究提供了理论支撑.<br>Based on the Garofalo-Arrhenius creep model, the finite element method is used to analyze the stress-strain response of low-silver Sn1.0Ag0.5Cu solder joints in WLCSP 5×6 device, and the fatigue life of Sn1.0Ag0.5Cu solder joints is calculated by the fatigue life prediction model. The results indicate that the warp of the electronic device can be found under alternating thermal cyclic loading, and the smallest value of stress-strain is in the central solder joints. The stress-strain increases obviously from central solder joints to corner solder joints, and the largest value of stress-strain is in the corner solder joints. With the advance of time in service, the creep strain in the solder joints increases significantly. The fatigue lives of Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu and Sn37Pb solder joints are calculated. It is found that the fatigue life of Sn3.0Ag0.5Cu is the highest of all, and the fatigue life of Sn1.0Ag0.5Cu is almost equivalent to that of Sn37Pb solder joints. Results demonstrate in theory that the low-silver Sn1.0Ag0.5Cu solder can be utilized to replace the traditional Sn37Pb solder, which can provide theory support for the researches of low Ag lead-free solders and solder joints reliability %K 蠕变模型 %K 无铅焊点 %K 翘曲现象 %K 应力-应变 %K 疲劳寿命< %K br> %K creep model %K lead-free solder joints %K warp phenomenon %K stress-strain %K fatigue life %U http://journal.seu.edu.cn/oa/darticle.aspx?type=view&id=201504010