%0 Journal Article
%T BGA/CSP植球机供球机构的设计及应用<br>Design and Application of Ball Supply Unit in BGA/CSP Ball Mounter
%A 刘劲松
%A 时威
%A 张金志
%J 机械科学与技术
%D 2016
%X 研究设计BGA/CSP植球机的供球机构，采用翻转预埋方式供球，锡球直径0.15~0.76 mm，解决市场上常见植球机振动盘供球方式易造成锡球缺失和粘连问题。针对该供球方式水平定位精度要求高，对真空植球头和供球机构之间的定位误差进行分析，得出供球机构传动链回程误差对植球头吸球效果影响较大，设计了气缸夹紧机构进行位置补正。对气缸夹紧机构进行受力分析和力矩分析来选用合适的气缸。最后通过设备调试，供球机构铺球效果良好，植球头能够完全吸取锡球，为高植球精度打下基础。<br>The ball supply unit is designed for the BGA/CSP (ball grid array, chip size package)ball mounter,it uses pre-buried method for ball supply and it can solve the problem of solder ball missing or conglutination, the ball size is from 0.15 mm to 0.76 mm. The ball supply unit requires high horizontal positioning precision. The mathematical model of alignment accuracy between the ball supply unit and the ball mount head is analyzed, and the error analysis shows that the backlash of the ball supply unit has a great influence on the commissioning of ball mount head. Because of the backlash error of the transmission chain, a mechanism is designed to eliminate the backlash. By calculating the stresses and torque, two suitable cylinders are selected. Finally, the experiments of commissioning indicate that the ball supply unit can realize the precision requirement of the ball mounter
%K BGA
%K CSP
%K 植球机
%K 供球机构
%K 回程误差&lt
%K br&gt
%K BGA
%K CSP
%K package
%K ball mounter
%K ball supply unit
%K design
%K mathematical model
%K calculation
%K error
%K error analysis
%K mechanism
%K stresses
%K experiments
%U http://journals.nwpu.edu.cn/jxkxyjs/CN/abstract/abstract6576.shtml