%0 Journal Article
%T Review of the Global Trend of Interconnect Reliability for Integrated Circuit
%A Qian Lin
%A Haifeng Wu
%A Guoqing Jia
%J Circuits and Systems
%P 9-21
%@ 2153-1293
%D 2018
%I Scientific Research Publishing
%R 10.4236/cs.2018.92002
%X Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs¡¯ interconnect reliability and help the new entrants to understand the present situation of this area.
%K Integrated Circuit
%K Interconnect Reliability
%K Interconnect Modeling
%K Interconnect Process
%U http://www.scirp.org/journal/PaperInformation.aspx?PaperID=82335