%0 Journal Article
%T Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments
%A Mohammad Tariq Jan
%A Nor Hisham Bin Hamid
%A Mohd Haris Md Khir
%A Khalid Ashraf
%A Mohammad Shoaib
%J Journal of Quality and Reliability Engineering
%D 2014
%R 10.1155/2014/987847
%X The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the most promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro- and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices is the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a high level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. This study reviews some of the major reliability issues and failure mechanisms. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions. 1. Introduction The microelectromechanical system (MEMS) is a rapidly evolving technology that incorporates electrical and mechanical elements at the microlevel. Due to the small size of MEMS devices, this technology has been widely appreciated in almost every field of life. MEMS devices possess a simple principle of operation and are easy to fabricate. The electronic components are fabricated using traditional integrated circuits (ICs) fabrication technology, while the mechanical parts are fabricated by using silicon and other substrates utilizing micromachining processes. Bulk [1] and surface micromachining [2] are the two main processes adopted for the fabrication of the mechanical parts of MEMS devices. The fabrication techniques, such as microfabrication, micromachining, and ICs, involve components that can range in size from the submicrometer level to the millimeter level [3]. The MEMS industries are constantly improving the design and fabrication techniques of these devices. MEMS, by virtue of its nature, corresponds to a distinctive technology that has transformed the entire MEMS industry. Bulky sensors and actuators can be replaced by miniaturized MEMS devices. MEMS accelerometers are frequently used in automobiles for air bag deployment; blood pressure sensors, microsyringes, and implantable biosensors in the medical and life
%U http://www.hindawi.com/journals/jqre/2014/987847/