%0 Journal Article
%T On MEMS Reliability and Failure Mechanisms
%A Daniel J. Fonseca
%A Miguel Sequera
%J Journal of Quality and Reliability Engineering
%D 2011
%R 10.1155/2011/820243
%X Microelectromechanical systems (MEMS) are a fast-growing field in microelectronics. MEMS are commonly used as actuators and sensors with a wide variety of applications in health care, automotives, and the military. The MEMS production cycle can be classified as three basic steps: (1) design process, (2) manufacturing process, and (3) operating cycle. Several studies have been conducted for steps (1) and (2); however, information regarding operational failure modes in MEMS is lacking. This paper discusses reliability in the context of MEMS functionality. It also presents a brief review of the most relevant failure mechanisms for MEMS. 1. Introduction Microelectromechanical systems (MEMS) are a relatively new and fast-growing field in microelectronics. MEMS are commonly used as actuators, sensors, and radio frequency and microfluidic components, as well as biocomposites, with a wide variety of applications in health care, automotive, and military industries. It is expected that the market for MEMS will grow to over $30B by 2050 [1]. The MEMS lifecycle can be divided into three basic steps: (1) the design process, (2) the manufacturing process, and (3) the operating cycle. Several research studies have been conducted for the design and manufacturing of MEMS; however, information regarding failure analysis for MEMS can still be considered in its infancy stage [2]. There is a need to develop new tools and methodologies to understand the behavior of MEMS devices for distinct applications and operation conditions. MEMS are extremely diverse and their failure modes can be unique under different conditions [3]. MEMS represent a technology that can be defined as miniaturized mechanical and electromechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. Dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters [4]. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. A main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality, whether or not these elements can move [4]. MEMS are manufactured using batch fabrication techniques similar to those used for integrated circuits. Unprecedented levels of functionality, reliability, and sophistication can be placed on a small silicon chip at a relatively low cost
%U http://www.hindawi.com/journals/jqre/2011/820243/