%0 Journal Article
%T Analyzing the Heat Transfer Property of Heat Pipe Influenced by Integrated Cooling Apparatus
%A Chen-Ching Ting
%A Chien-Chih Chen
%J Chinese Journal of Engineering
%D 2014
%R 10.1155/2014/409074
%X Heat pipe with discrete heat transfer property is often called thermal superconductor because it has extremely large thermal conductivity. This special heat transfer property is destroyed by integrating cooling apparatus and further reducing the cooling power of a heat pipe cooler. This paper experimentally studied the heat transfer property of heat pipe influenced by integrated cooling apparatus. To simplify the investigating process, a home-made square heat pipe with the dimensions of £¿mm3 was built with two pieces of copper plates and two pieces of glass plates face to face, respectively. The two pieces of copper plates were constructed with inside walls of capillary structure and the two pieces of glasses were with antifog inside walls for observing the inner phenomenon. Moreover, isothermal circulating cooling water was applied outside the heat pipe instead of cooling fin. The results show that heat vapor in the heat pipe is condensed earlier and cannot reach the remote section of condenser. In other words, the heat transfer property of heat pipe is destroyed by integrating cooling water. This phenomenon causes the unfavorable cooling power of the heat pipe cooler. 1. Introduction Nowadays, advanced fabricating technique in production of semiconductor components provides feasibility to fabricate electronic devices with more precision and high working frequency. The electronic devices with high working frequency in optoelectronics, communication, electric power, aerospace, biomedicine, and so forth often yield extremely large amounts of heat in a small area. Overheat causes the electronic devices to crash or even break. According to Moore¡¯s law issued by Intel, the more transistors in a chip also yield the quicker operating speed, but the generated heat by the transistors is also increased. If the transistors cannot be instantaneously and effectively cooled, the hot spots on the chip will appear and damage the transistors. A current popular application of high power LED is the suitable sample. Figure 1 shows junction temperature versus life time for the high power white light LED and indicates that the junction temperature with ca. 10¡ãC increment causes the life time to be halved [1]. Figure 1: Junction temperature versus life time for the high power white light LED [ 1]. Cooling normally aims to take waste heat away from the heat source and keep regular work of the electronic products. In general, cooling methods are divided into active and passive in terms of their different working principles. The active cooling uses refrigerating technique to
%U http://www.hindawi.com/journals/cje/2014/409074/