%0 Journal Article
%T Underpotential and overpotential deposition of Al onto Cu(111) from the AlCl3每EtMeImCl room temperature molten salt
%A V. D. JOVIC
%J Journal of the Serbian Chemical Society
%D 2006
%I Serbian Chemical Society
%X The processes of underpotential (UPD) and overpotential (OPD) deposition ofAl onto Cu(111), from the room temperature molten salt AlCl3每EtMeImCl of different compositions, has been investigated by the cyclic volatmmetry (CV) and potentiostatic pulse techniques. It was shown that the CVs of the UPD are characterized by two sharp peaks, while the potentiostatic cathodic and anodic j每t-transients of this process are characterized by two waves, indicating that the UPD of Al results in the formation of two structures. The first, less dense one,most probably the (sqrt3 x sqrt3) R30 o ordered structure of Al, is formed at a more positive potential of about 200 mV vs. Al, while the second one, a complete momolayer of Al, is formed at about 20 mV vs. Al, just before the reversible potential of Al in these melts (每20mV vs. Al). The OPD of Al was detected at potentials more negative than 每30 mV vs. Al, occurring through the progressive 3D nucleation and growth mechanism. Slow surface alloying of Al with Cu was found to occur at a potential close to the reversible potential of Al.
%K AlCl3每EtMeImCl
%K room temperature molten salt
%K UPD and OPD
%K Cu(111)
%K (sqrt3 x sqrt3) R30o
%K progressive 3D nucleation and growth
%K Al每Cu surface alloying
%U http://www.shd.org.yu/HtDocs/SHD/Vol71/No4/JSCS_V71_No4-06.pdf