%0 Journal Article
%T Evolution and Prospect of Thermal Spraying Technique
%A YIN Zhi-Jian
%A 
%A WANG Shu-Bao
%A FU-Wei
%A TAN Xin-Hai
%A TAO Shun-Yan
%A DING Chuan-Xian
%J 无机材料学报
%D 2011
%I Science Press
%R 10.3724/sp.j.1077.2011.00225
%X In this article, current state development and process evolution ofthermal spray technology during last century (1910―2010) were reviewed. An "three―step evolution trend" (heat energy dominance, kineticenergy dominance, innovative idea and composite performance dominance) wasadvanced in order to get comprehensive understanding on this technology and dobetter in promoting its future development. Low pressure plasma spraying―thinfilm (LPPS―TF), cold spray (CS) and suspension orsolution srecursor plasma spray (SPS/SPPS) were selected among emerging novelspray processes to be briefly introduced from two aspects (process characteristics and potential applications). Comparison of spray output valueand detail contribution ratio distribution of various industry or process through world and Asia spray industry market were made to probe into what canbe improved as for China thermal spray industry in future. It was suggested that increasing plasma spray and HVOF contribution to applications, take activesteps to explore R&D of some novel spray technology like above mentioned and their possible applications especially in high―tech industrial such aselectrics, semiconductor and new energy.
%K thermal spray evolutionapplicationprospectreview
%U http://www.jim.org.cn/fileup/PDF/2011-26-3-225.pdf