%0 Journal Article
%T Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
%A M. I. Loupis
%A J. N. Avaritsiotis
%A G. D. Tziallas
%J Active and Passive Electronic Components
%D 1994
%I Hindawi Publishing Corporation
%R 10.1155/1994/60298
%U http://dx.doi.org/10.1155/1994/60298