%0 Journal Article
%T On-Wafer Measurements for Extraction of Effective Dielectric Constant in IC Transmission Lines on Multilayer Substrates
%A R. G. Arnaudov
%A R. B. Borisov
%J Telfor Journal
%D 2012
%I Telecommunications Society, Academic Mind
%X Methodology for extracting an effective dielectric constant of microstrip transmission lines on multilayer substrates, from measured or simulated S-parameters data, using on-chip test structures, has been demonstrated. The methodology consists of: 1) building on-chip interconnect structures usually implemented in calibration and de-embedding procedures in microwave on-wafer test and measurements ¨C transmission lines, stubs and pad launchers; 2) extracting the effective dielectric constant from the characteristic impedance and propagation constant of these structures, fully described by the measured or EM-simulated S-parameters. The demonstrated methodology is applicable for evaluation of dielectric and semiconductor multilayer substrates, both with lossy and lossless characteristics over a broad frequency band. Another advantage is implementation of very short transmission line structures with physical dimensions much smaller than a quarter wavelength of the highest investigated band frequency, thus preserving a valuable chip area in the test structures and being compatible with some of the calibration TRL elements.
%K Calibration and de-embedding structures
%K characteristic impedance
%K effective dielectric constant
%K multilayer substrates
%K on-wafer test and measurements
%K propagation constant
%K S-parameters
%U http://journal.telfor.rs/Published/Vol4No2/Vol4No2_A12.pdf