%0 Journal Article
%T Study of the Coil Structure for Wireless Chip-to-Chip Communication Applications
%A Changhyun Lee
%A Jonghoon Park
%A Jinho Yoo
%A Changkun Park
%J PIER     Letters
%D 2013
%I EMW Publishing
%R 10.2528/PIERL13022002
%X In this work, we propose a merged coil structure for wireless chip-to-chip communication technology. Using the proposed coil structure, the chip size can be reduced, and the transmitted power can be improved by approximately 5 dB compared to typical coil structure. To verify the feasibility of the coil, an electromagnetic simulation and a schematic simulation are performed. The coil was implemented using 50-nm digital CMOS technology. From the experimental results, the feasibility was proved.
%U http://www.jpier.org/pierl/pier.php?paper=13022002