%0 Journal Article
%T SIMULATION AND DESIGN OF MICRO-ELECTRONIC PACKAGING<br>微电子封装结构设计与仿真分析
%A 江国宁
%J 力学与实践
%D 2009
%I 
%X In recent years, the product of semiconductor related technologies tend toward to the direction of high density, high performance, multi-physics and miniaturization characteristics. Furthermore, high reliability, low fabrication cost and time-to-market features are the key elements making microelectronic devices to meet the worldwide highly competitive competition. Facing the aforementioned severe challenges, a new design methodology based on the computer simulation technology should be developed to adapt to the new era of ever so various fabrication processes, system integration and next generation electronic packaging devices. Miniaturization induced technology barriers such as process/material uncertainty, structural complexity, high fabrication cost and long development cycles, etc. make conventional design procedure (experiment based design technology, e.g., try-and-error method) inapplicable. Therefore, nowadays, simulation based design-on-simulation design concept has been widely adopted as the mainstream technology by worldwide semiconductor related companies and institutions.
%K miniaturization
%K multi-physics characteristics
%K reliability
%K simulation
%K try-and-error<br>微小化
%K 多重物理特性
%K 可靠度
%K 模拟分析
%K 试误法
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=0BF5C9FB031A532ED0A6D99DC4F6181A&aid=AB1A3EED60E7C9ECF9B82811762D19F1&yid=DE12191FBD62783C&vid=4AD960B5AD2D111A&iid=0B39A22176CE99FB&sid=CA4FD0336C81A37A&eid=F3090AE9B60B7ED1&journal_id=1000-0879&journal_name=力学与实践&referenced_num=0&reference_num=11