%0 Journal Article
%T Nano-indentation Test and Stress Field Analysis of Silicon Crystals<br>硅晶体纳米压痕试验与应力场分析
%A WANG Jiu gen
%A RYMUZA Z
%A <br>汪久根 RYMUZA
%A Z
%J 摩擦学学报
%D 2001
%I 
%X Silicon and silicon coating system are extensively used in the engineering of micro electronic and mechanical systems (MEMS). Nano indentation is usually used to measure the material hardness and assess its tribological properties. Thus nano indentation test was carried out to measure the hardness of silicon crystals and investigate the feature of indentation load versus depth the curves. The stress field distributions of the silicon crystal during the loading and unloading process of indentation test were analyzed. The Mises stress field and stress fields in six directions indicate that the failure of thin wafer of silicon crystals during nano indentation test is attributed to the spalling under shearing and normal stress.
%K silicon crystal
%K nano
%K indentation
%K nano
%K hardness
%K stress field<br>硅晶体
%K 纳米压入法
%K 纳米硬度
%K 应力分布
%K 应力场
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=2F467A5C6371C830162AAA01D7DAD07A&aid=F96306FA4ED6912F&yid=14E7EF987E4155E6&vid=659D3B06EBF534A7&iid=B31275AF3241DB2D&sid=8CE1095CD639AEF4&eid=D397660E39E3E461&journal_id=1004-0595&journal_name=摩擦学学报&referenced_num=6&reference_num=14