%0 Journal Article
%T Design of PCB ground planer for 3G wireless terminal<br>3G无线终端高密度PCB的地平面设计
%A 林峰
%A 王筑
%A 黄学达
%J 重庆邮电大学学报(自然科学版)
%D 2011
%I 
%X During the high density interconnection printed circuit board design, the ground planer has an effect on the Electro Magnetic Compatibility of the entire circuit.The proper design of ground planer can minimize noise caused by currents switching through stray inductance,help to reduce noise caused by crosstalk and reflections, and help to control noise emitted outside the system.This paper discusses the design of ground planer in HDI PCB,bases on a 3G wireless terminal circuit,and also gives a method of ground planer splitting or sewing,and a method of entire shield.By using these methods, the EMC of 3G wireless terminal is optimized, and the RF characteristic is also improved greatly.
%K high density interconnection(HDI)
%K ground planer
%K electro magnetic compatibility(EMC)<br>高密度互联
%K 地平面
%K 电磁兼容性能
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=01BA20E8BA813E1908F3698710BBFEFEE816345F465FEBA5&cid=96E6E851B5104576C2DD9FC1FBCB69EF&jid=5C2694A2E5629ECD6B59D7B28C6937AD&aid=8A9892E12714AC7FADFC23BBEDEF8FF4&yid=9377ED8094509821&vid=EA389574707BDED3&iid=94C357A881DFC066&sid=6313C162FF75889A&eid=811ACA5D3673A764&journal_id=1673-825X&journal_name=重庆邮电大学学报(自然科学版)&referenced_num=0&reference_num=0