%0 Journal Article
%T Research of Chip Recognition in the Automatic Bonder<br>自动焊机中芯片识别技术的研究
%A ZHONG Xue-Ling
%A BAO Su-Su
%A <br>钟雪灵
%A 鲍苏苏
%J 计算机科学
%D 2006
%I 
%X In semiconductor production, there is one person operating one machine by hands in the later process of bonder. According to this situation, in this paper, the software proposal of reconstruction is brought forward, and the key skill in the chip recogniti
%K Automatic bonder
%K Image recognition
%K Template matching
%K Sequential similarity detection algorithm(SSDA)<br>自动焊机
%K 图形识别
%K 模板匹配
%K 序贯相似检测算法(SSDA)
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=8240383F08CE46C8B05036380D75B607&jid=64A12D73428C8B8DBFB978D04DFEB3C1&aid=517470134FE18A77&yid=37904DC365DD7266&vid=27746BCEEE58E9DC&iid=708DD6B15D2464E8&sid=28F9D9CF04F424FF&eid=FBA00558C57D9C11&journal_id=1002-137X&journal_name=计算机科学&referenced_num=0&reference_num=15