%0 Journal Article
%T BEHAVIOUR OF BUFFER LAYER IN JOINING OF SIALON CERAMICS TO STEEL 40Cr
%A XIAN Aiping SI Zhongyao Institute of Metal Research
%A Academia Sinica
%A Shenyang
%A China Doctoral Candidate
%A Laboratory of Welding
%A Joining
%A <br>XIAN Aiping SI Zhongyao Institute of Metal Research
%A Academia Sinica
%A Shenyang
%A China Doctoral Candidate
%A Laboratory of Welding and Joining
%A Institute of Metal Research
%A Academia Sinica
%A Shenyang
%A China
%J 金属学报(英文版)
%D 1992
%I 
%X The buffer layer material itself may be influential to the bond strength between active brazingfiller and ceramics.For Ag_(57)Cu_(38)Ti_5 filler metal,Cu or Ta is excellent buffer layer material,but Kovar or Ni-15Cr-15Co is worse.It was important to design a layer of soft buffer,suchas Cu,to relax interfacial stress rather than hard buffer layer,such as Mo,to avoid stress.There is an optimum thickness range of soft buffer layer,saying h/L=0.02—0.1. It was agood solution to the interfacial stress problem to use soft/hard buffer layer to increasemetal/ceramics joint strength.Finally,an idea of designing gradual materials as buffer layerbetween metal and ceramics was suggested.
%K ceramic/metaljointing
%K Sialon
%K steel 40Cr
%K active brazing
%K interlayer<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=C19B08D052F5FD8445F4BB80A1A5D7BF&aid=646412CFC05D624DF38646BCF2FD87B9&yid=F53A2717BDB04D52&vid=94C357A881DFC066&iid=9CF7A0430CBB2DFD&sid=BC084ACE66B62CC8&eid=EF27C460877D3C9F&journal_id=1006-7191&journal_name=金属学报(英文版)&referenced_num=0&reference_num=12