%0 Journal Article
%T INTERACTION BETWEEN Cu AND LIQUID Sn—Also on Physical Meaning of Wetting Curve
%A ZHANG Qiyun HAN Wanshu LIU Junkang Peking University
%A Beijing
%A China ZHANG Qiyun Professor
%A Dept.of Chemistry
%A Peking University
%A Beijing
%A China
%J 金属学报(英文版)
%D 1990
%I 
%X The interaction between Cu and liquid Sn was studied by microstructure observation.Thecurve of the dipping time with related to dissolving and diffusion of Cu in liquid Sn is given.The Cu dissolves rapidly in liquid Sn at the beginning,then an intermetallic compoundCu_6Sn_5 forms,and the dissolving follows to slow down.At temperature up to 350℃,the hardfeather-like Cu_6Sn_5 is sharply growing up and speads through the dipped Sn laver.The wayto inhibit the growth of the intermetallic compound Cu_6Sn_5 was also approached.Thus,on theabove mentioned basis,the physical meaning of the wetting curve traced by the meniscographwettability tester has been derived as film detaching,Cu dissolying and Cu_6Sn_5 growing.
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=C19B08D052F5FD8445F4BB80A1A5D7BF&aid=28CA07A6ACC10C7119EA8B1CED6C66AA&yid=8D39DA2CB9F38FD0&vid=38B194292C032A66&iid=9CF7A0430CBB2DFD&sid=EB552E4CFC85690B&eid=7CE3F1F20DE6B307&journal_id=1006-7191&journal_name=金属学报(英文版)&referenced_num=0&reference_num=8