%0 Journal Article
%T Fabrication cost analysis of three-dimensional integrated circuits<br>三维芯片制造成本分析
%A WU Ji
%A WANG Gao-feng
%A WANG Hao
%A <br>吴　际
%A 王高峰
%A 王　豪
%J 计算机应用研究
%D 2012
%I 
%X Merits of three-dimensional 3D integration offers a technology that meets the requirements of the current trend in many-core processors. However, cost is always the dominant factor of adoption of this new technology. After it implemented introduction of a fabrication cost model which evaluated 2D, homogeneous 3D and heterogeneous 3D architectures in some designs. The fabrication costs of these designs and drawn a conclusion that when the number of gates was large, 3D implementations were more and more cost-efficient than the 2D baseline with the increase of gates.
%K three-dimensional integrated circuits
%K cost analysis
%K cost model<br>三维芯片
%K 成本分析
%K 成本模型
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=8240383F08CE46C8B05036380D75B607&jid=A9D9BE08CDC44144BE8B5685705D3AED&aid=9B3C227A81E2A28C165E318117D58ECE&yid=99E9153A83D4CB11&vid=771469D9D58C34FF&iid=9CF7A0430CBB2DFD&sid=1A35A12E99A5EF57&eid=CEED57D4388930C9&journal_id=1001-3695&journal_name=计算机应用研究&referenced_num=0&reference_num=7