%0 Journal Article
%T Microstructures and Fatigue Damage of Submicron Thick Copper Films<br>亚微米厚铜薄膜的微观结构及疲劳损伤行为
%A ZHANG Bin
%A SUN Kaihong
%A LIU Yongdong
%A ZHANG Guangping
%A <br>张 滨
%A 孙恺红
%A 刘永东
%A 张广平
%J 金属学报
%D 2006
%I 
%X Submicrons thick Cu films were deposited on polyimide substrates with high elasticity and mechanical stability by a magnetron sputtering system.Microstructures of the Cu films were characterized by TEM,electron backscatter imaging of SEM as well as XRD technique.Fatigue damage behaviors of the submicron thick Cu films were investigated under constant load amplitude control.It was found that there exists a large number of micro/nanoscale twins in the annealed films and(111) texture formed in the films.Fatigue extrusions and cracking in the Cu films were suppressed under constant load amplitude control.The fatigue cracks dominantly initiate at the interfaces,where exist strong dislocation interaction at twin boundaries and deformation incompatibility near the interfaces. The enhance of fatigue strength of the submicron thick Cu films results from the constraints of three scales of film thickness,grain size and twin size.
%K Cu thin film
%K submicron-scale
%K fatigue
%K microstructure<br>铜薄膜
%K 亚微米尺度
%K 疲劳
%K 微观结构
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=5128C3FF8AE08161&yid=37904DC365DD7266&vid=ECE8E54D6034F642&iid=CA4FD0336C81A37A&sid=CA4FD0336C81A37A&eid=94C357A881DFC066&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=14