%0 Journal Article
%T SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING<br>电子封装微互连焊点力学行为的尺寸效应
%A YIN Limeng
%A YANG Yan
%A LIU Liangqi
%A ZHANG Xinping School of Materials Science
%A Engineering
%A South China University of Technology
%A Guangzhou
%A <br>尹立孟
%A 杨艳
%A 刘亮岐
%A 张新平
%J 金属学报
%D 2009
%I 
%X Mechanical behaviors of miniature solder joint interconnections with different scale matches, diameter (d) in the range of 200—575 μm and length (l) of 75—525 μm, were investigated by using quasi–static micro–tensile testing. The results show that the joint geometry scaling factor (d/l) plays an important role in influencing the mechanical constraint level and tensile strength of the solder joints. However, with increasing d/l, the tensile strength of the joints does not always increase and not always exhibit a similar trend to that predicted by Orowan approximation equation, but there is an inverse size effect on the solder joint strength. For both lead–free and lead–containing solders, the correlation between the tensile strength and volume of the solder joints largely follows inverse proportion function equation, i.e., σF Joint = 1/(Ad2l) + B, where tensile strength of the solder joints increases obviously with the decrease of the solder joint volume and there is a so–called "solder joint volume effect", that is, the smaller the solder joint volume, the higher the solder joit strenth.
%K electronic packaging
%K miniature solder joint interconnection
%K size effect
%K tensile strength
%K constraint effect<br>电子封装
%K 微互连焊点
%K 尺寸效应
%K 拉仲强度
%K 约束效应
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=1B90719A59D12BCA7F2FB7D94919B465&yid=DE12191FBD62783C&vid=94E7F66E6C42FA23&iid=E158A972A605785F&sid=B941678158018439&eid=CB3428B1EFB1C133&journal_id=0412-1961&journal_name=金属学报&referenced_num=4&reference_num=20