%0 Journal Article
%T MICROSTRUCTURE AND ITS SCALES OF Cu-70%Sn PERITECTIC ALLOY UNDER HIGH-TEMPERATURE GRADIENT DIRECTIONAL SOLIDIFICATION<br>Microstructure And Its Scales Of Cu--70%Sn Peritectic Alloy Under High—Temperature Gradient Directional Solidification
%A LI Shuangming
%A MA Baile
%A L&#
%A Haiyan
%A LIU Lin
%A FU Hengzhi
%A <br>李双明
%A 马伯乐
%A 吕海燕
%A 刘 林
%A 傅恒志
%J 金属学报
%D 2005
%I 
%X 在凝固速率1-500 μm／s的范围内,Cu-70％Sn包晶合金定向凝固组织由ε相、包晶η相和共晶体组成,ε相为 领先相与最高界面生长温度假设的分析一致.理论计算结果显示,当凝固速率大于22.35 mm／s时,η相可直接从液相中析出, 无需通过包晶反应进行.凝固速率越低,ε向η相固相转变系数越大,造成ε相尺寸在1-5μm／s范围内变化很小,而包晶η 相的体积分数随凝固速率的增加呈现先减后增的变化趋势.在凝固速率小于50#m／s时, Cu-70％Sn包晶合金一次枝晶间距 满足λV0.325=199.5μm1.325·s-0.325;在凝固速率高于50μm／s时,一次枝晶间距满足λV0.528=676 μm1.528·s-0.528.
%K directional solidification
%K Cu-70%Sn peritectic alloy
%K primary dendritic arm spacing
%K microstructure<br>定向凝固
%K Cu-70％Sn包晶合金
%K 枝晶间距
%K 显微组织
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=B6224EB1427D46D2&yid=2DD7160C83D0ACED&vid=2001E0D53B7B80EC&iid=E158A972A605785F&sid=34D9E20AD82A0D72&eid=1FF3CD54EFC256A1&journal_id=0412-1961&journal_name=金属学报&referenced_num=7&reference_num=19